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ISL5239
Absolute Maximum Ratings
Thermal Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . +2.5VCCC, 4.6V VCCIO
Thermal Resistance (Typical, Notes 1, 2)
θ JA ( o C/W)
Input, Output or I/O Voltage . . . . . . . . . . . . . . . . . GND -0.5V to 5.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 2
Operating Conditions
Voltage Range Core, V CCC . . . . . . . . . . . . . . . . . . +1.71V to +1.89V
Voltage Range I/O, V CCCIO (Note 3) . . . . . . . . . +3.135V to +3.465V
Temperature Range
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 o C to 85 o C
196 BGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . 42
w/200 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . . 38
w/400 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . . 36
Maximum Storage Temperature Range . . . . . . . . . . -65 o C to 150 o C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 125 o C
For Recommended Soldering Conditions, See Tech Brief TB334.
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +0.8V
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to V CC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. θ JA is measured in free air with the component mounted on a high effective thermal conductivity test board. See Tech Brief TB379.
2. With “direct attach” features (i.e., vias in the PCB), the thermal resistance is 36 without airflow, w/200 it is 33, w/400 it is 31 o C/W. Tie 196 BGA
package pins F6-9, G6-9, H6-9, J6-9 to heat sink or ground with vias to ensure maximum device heat dissipation.
3. Single supply operation of both the core VCCC and I/O VCCIO at 1.8V is not allowed.
DC Electrical Specifications V CCC = 1.8± 5%, V CCIO = 3.3 ± 5%, T A = -40 o C to 85 o C
PARAMETER
Logical One Input Voltage
Logical Zero Input Voltage
Clock Input High
Clock Input Low
Output High Voltage
Output Low Voltage
Input Leakage Current
SYMBOL
V IH
V IL
V IHC
V ILC
V OH
V OL
I L
TEST CONDITIONS
V CCC = 1.89V, V CCIO = 3.465V
V CCC = 1.71V, V CCIO = 3.135V
V CCC = 1.89V, V CCIO = 3.465V
V CCC = 1.71V, V CCIO = 3.135V
I OH = -2mA, V CCC = 1.71V, V CCIO = 3.135V
I OL = 2mA, V CCC = 1.71V, V CCIO = 3.135V
V IN = V CCIO or GND, V CCC = 1.89V,
MIN
2.0
-
2.0
-
2.6
-10
Typ
V CC -0.2
0.2
1
MAX
-
0.8
-
0.8
-
0.4
10
UNITS
V
V
V
V
V
V
μ A
V CCIO = 3.465V
Output Leakage Current
I H
V IN = V CCIO or GND, V CCC = 1.89V,
-10
1
10
μ A
V CCIO = 3.465V
Input Pull-up Leakage Current Low
I SL
V IN = V CCIO or GND, V CCC = 1.89V,
-100
-50
-
μ A
V CCIO = 3.465V, TMS, TRST, TDI
Input Pull-up Leakage Current High
I SH
V IN = V CCIO or GND, V CCC = 1.89V,
-
1
10
μ A
V CCIO = 3.465V, TMS, TRST, TDI
Standby Power Supply Current
I CCSB
V CCC = 1.89V, V CCIO = 3.465V, Outputs Not
-
1
3
mA(core)
Loaded
100
500
uA(I/O)
Operating Power Supply Current
I CCOP
f = 125MHz, V IN = V CCIO or GND,
-
300
mA (Core)
V CCIO = 3.465V, V CCC = 1.89V,
100
mA(I/O),
(Note 4)
Input Capacitance
C IN
Freq = 1MHz, V CCIO Open, All Measurements
-
5
pF (Note 5)
Are Referenced to Device Ground
Output Capacitance
C OUT
Freq = 1MHz, V CCIO Open, All Measurements
-
5
pF (Note 5)
are Referenced to Device Ground
NOTES:
4. Power Supply current is proportional to operation frequency. Typical rating for I CCOP is 2.0 mA/MHz (core) and 0.5mA/MHz(I/O),
5. Capacitance T A = 25 o C, controlled via design or process parameters and not directly tested. Characterized upon initial design and at major
process or design changes.
15
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